FPC yog dab tsi? Dab tsi ntawm FPC faib rau?

Cov ntawv luam tawm yooj yim yog ua los ntawm polyimide lossis polyester zaj duab xis, nrog kev ntseeg siab, thiab hloov tau yooj yim luam tawm Circuit Court boards. Lub npe hu ua soft board lossis FPC. Nta: siab hlau ceev, lub teeb yuag, nyias thickness; Feem ntau siv rau hauv xov tooj ntawm tes, phau ntawv computers, PDAs, digital koob yees duab, LCMs thiab lwm yam khoom.

FPC

Hom FPC

Ib txheej FPC

Nws muaj chemically etched conductive qauv, thiab cov txheej txheem conductive nyob rau saum npoo ntawm cov ntaub ntawv yooj yim insulating substrate yog dov tooj liab ntawv ci. Cov insulating substrate yuav yog polyimide, polyethylene terephthalate, aramid cellulose ester, thiab polyvinyl chloride. Ib txheej FPC tuaj yeem muab faib ua plaub pawg hauv qab no:

Ib sab kev sib txuas tsis npog txheej

Cov qauv ntawm cov hlau yog nyob rau ntawm insulating substrate, thiab tsis muaj txheej txheej ntawm hlau nto. Kev sib txuas yog pom tau los ntawm kev siv vuam, vuam lossis vuam vuam, uas feem ntau siv hauv xov tooj thaum ntxov.

Kev sib txuas ib sab npog

Piv nrog rau hom yav dhau los, tsuas muaj ib txheej txheej ntawm cov hlau. Cov ntaub qhwv yuav tsum raug nthuav tawm thaum npog, thiab qhov kawg ntawm qhov kawg tuaj yeem tsuas yog tsis npog. Nws yog qhov siv ntau tshaj plaws thiab feem ntau siv ib leeg-ib tog hloov pauv PCB rau cov cuab yeej siv tsheb.

Kev sib txuas ob sab tsis npog txheej

Kev sib txuas ntawm cov ntaub qhwv tuaj yeem txuas rau pem hauv ntej thiab nraub qaum ntawm cov xaim, lub qhov channel qhib rau ntawm cov ntaub ntawv insulating ntawm lub ncoo, thiab qhov xav tau txoj hauj lwm ntawm insulating substrate tuaj yeem ntxuav, etched lossis lwm yam kev siv tshuab.

Muab ob npaug rau sab npog kev sib txuas

Qhov sib txawv ntawm qhov qub yog tias muaj cov txheej txheem npog ntawm qhov chaw, thiab cov txheej txheem npog muaj ntawm lub qhov, tso cai rau ob tog raug txiav thiab tseem tuav cov txheej txheej. Nws yog ua los ntawm ob txheej ntawm insulating cov ntaub ntawv thiab ib txheej ntawm hlau conductors.

Ob sab FPC

Ob sab FPC muaj ib txheej ntawm etched conductive qauv ntawm ob sab ntawm insulating puag zaj duab xis, uas ua rau kom cov xov hlau ceev ntawm ib cheeb tsam. Lub qhov hlau txuas cov qauv ntawm ob sab ntawm cov khoom siv insulating los ua ib txoj hauv kev ua kom tau raws li kev siv mos. Lub npog zaj duab xis tuaj yeem tiv thaiv ib leeg thiab ob sab ntawm cov xov hlau thiab qhia qhov chaw ntawm cov khoom. Raws li kev xav tau, metallized qhov thiab npog txheej yog xaiv tau, thiab hom FPC no siv tsawg dua.

Multilayer FPC

Multi-txheej FPC laminates 3 los yog ntau txheej txheej ntawm ib sab los yog ob-sided saj zawg zog circuits ua ke, thiab hlau qhov yog tsim los ntawm drilling L. electroplating los tsim conductive paths ntawm txawv txheej. Yog li ntawd, tsis muaj txheej txheem vuam nyuaj yuav tsum tau ua. Multilayer circuits muaj qhov sib txawv ua haujlwm zoo nyob rau hauv cov nqe lus ntawm kev ntseeg siab dua, thermal conductivity zoo dua, thiab kev sib dhos yooj yim dua.

Qhov zoo dua yog tias lub hauv paus zaj duab xis yog lub teeb hauv qhov hnyav thiab zoo heev hauv cov khoom hluav taws xob, xws li tsis tshua muaj dielectric. Lub multilayer saj zawg zog PCB pawg thawj coj saib ua los ntawm polyimide zaj duab xis yog li 1/3 sib zog tshaj epoxy iav ntaub ntaub multilayer PCB pawg thawj coj saib, tab sis nws poob qhov zoo heev saj zawg zog ntawm ib sab thiab ob-sided saj zawg zog PCBs. Cov khoom no Feem ntau tsis xav tau yooj. Multi-layer FPC tuaj yeem muab faib ua ntau hom hauv qab no:

Tiav lawm saj zawg zog insulating substrate

Pawg no yog tsim los ntawm ib qho yooj yim insulating substrate, thiab nws cov khoom tiav yog teev raws li ib tug saj zawg zog insulating substrate. Cov qauv no feem ntau khi ob qhov kawg ntawm ntau ib leeg lossis ob sab microstrip saj zawg zog PCBs ua ke, tab sis lub hauv paus tsis sib koom ua ke, yog li nws muaj kev hloov pauv siab. Txhawm rau kom muaj kev hloov pauv siab, cov xaim txheej tuaj yeem siv cov txheej nyias nyias, xws li polyimide, tsis yog txheej tuab.

Ua tiav soft insulating substrate

Hom no yog tsim los ntawm cov mos mos insulating substrate, thiab cov khoom tiav tsis hloov pauv. FPC ntau txheej no siv cov ntaub ntawv mos mos xws li polyimide zaj duab xis los laminated rau hauv ntau txheej pawg thawj coj saib, uas poob nws qhov kev hloov pauv tom qab lamination.